3D InCites Podcast
As a semiconductor industry community, 3D InCites brings to life the people, the personalities, and the minds behind heterogeneous integration and related technologies in a uniquely personal way. The goal is to inform key decision-makers about progress in technology development, design, standards, infrastructure, and implementation.The 3D InCites Podcast provides a forum for our community members to discuss all kinds of topics that are important to running a business in the semiconductor industry, from marketing to market trends, important issues that impact our industry, and our success stories.
- Update frequency
- every 7 days
- Average duration
- 35 minutes
- Episodes
- 175
- Years Active
- 2021 - 2025
Koh Young's Michael Zahn Talks About Putting 3D Measurement Technology to Work for Semiconductor Manufacturing
This episode was recorded live at SEMICON Europa.
Michael Zahn from Koh Young talks to Françoise von Trapp about the growing significance of metrology in semiconductor manufacturing and…
SEMICON Europa 3D InCites Member Spotlight: 20 Under 30 Recipients and More
This episode was recorded live at SEMICON Europa. It features interviews with four of the 20 under 30 Recognition Award recipients from Cadence, ERS Electronic, KLA, and Semilab. It al…
SEMICON Europa 2024: Can Digital Twins Help Solve Europe's Talent Gap and Build Technical Sovereignty?
In this episode, recorded live at SEMICON Europa in Munich, Françoise von Trapp continues her conversations with the keynote speakers on helping to build Europe’s technical sovereignty,…
SEMICON Europa 2024: How Do We Power Sustainable Exponential Growth?
This episode was recorded live at SEMICON Europa in Munich. This year's theme of this year’s conference is "Innovation and Collaboration: Powering Sustainable Exponential Growth". In ot…
The U.S. CHIPS for America Mash-Up
It's been quite an exciting year for the U.S. Chips for America as the funding starts rolling out. All year long, Françoise von Trapp has interviewed various government dignitaries abou…
Onto Innovation's PACE Partners Talk About Collaborating on Panel-Level Packaging
On September 30, 2024, Onto Innovation held the grand opening of its Packaging Applications Center of Excellence - or as it's being called, PACE. Françoise von Trapp attended the grand …
Witnessing Foundry 2.0 In Action with NHanced Semiconductor's Bob Patti and Carl Petteway
For this 3D InCites Podcast Extra, Françoise von Trapp traveled to Morrisville, North Carolina, to witness Foundry 2.0 in action at NHanced Semiconductors.
She speaks with founder and C…
LIVE from Boston MA: Member Highlights from IMAPS Symposium 2024
Recorded live at the IMAPS Symposium 2024 in Boston MA, where 3D InCites member companies presented their latest technologies and showcased their products. This episode features convers…
IMAPS Society Award Winners Talk About How Belonging to IMAPS Enriched Their Microelectronics Careers
At IMAPS Symposium 2024, the annual IMAPS Society Awards were presented. These awards recognize IMAPS members who stand out for their efforts. They are peer-nominated awards and selecte…
Live from IMAPS Symposium 2024: Updates on the NAPMP, Silicon Photonics and RDL Packaging
This episode was recorded live at the IMAPS International Symposium in Boston MA. Françoise von Trapp speaks with Dev Palmer, director of the National Advanced Packaging Manufacturing …
Lam Research’s Chee Ping Lee Explains the Role of HBM in Generative AI
In this episode, Françoise von Trapp speaks with Chee Ping Lee, of Lam Research, about the critical role of high bandwidth memory (HBM) in generative AI, emphasizing its high bandwidth …
Comet's Isabella Drolz Explains How 3D X-Ray Uses AI to Help Build AI Chips
In this episode, Francoise von Trapp speaks with Isabella Drolz from Comet about how AI is revolutionizing semiconductor inspection strategies, particularly in 3D X-ray systems. They di…
So You Want To Be an Interconnectologist? A Conversation with Simon McElrea of LQDX
In this episode, Francoise speaks with Simon McElrea, an interconnectologist, about his career in and the evolution of interconnectology, emphasizing its importance in semiconductor pac…
Monita Pau and Jiangtao Hu Talk About Addressing The Challenges of Metrology for Advanced Packaging
In this episode, Françoise von Trapp talks with Onto Innovation’s Monita Pau and Jiangtao Hu about metrology for advanced packaging – why do we need it? What are the challenges, and how…
Tarak Railkar and Benson Chan Preview IMAPS Symposium 2024
In this episode, Tarak Railkar and Benson Chan join Françoise von Trapp for a preview of The IMAPS International Symposium 2024, which takes place in Boston from September 30 to Octobe…
Bruce Kim of SurplusGLOBAL: The Impact of the CHIPS Act on the Secondary Equipment Market
In this episode, Françoise von Trapp speaks with Bruce Kim, of SurplusGLOBAL, for an update on the semiconductor secondary equipment market, and how the US. and European Chips Acts are …
30 Years of Underfill Technology: How Societal and Technological Challenges Impact Materials Development
In this episode, Françoise von Trapp and underfill materials expert, Dick Jensen, NAMICS corporation explore the societal and technological challenges that impact microelectronic materi…
SEMICON West 2024: Updates on The SEMI Climate Consortium and Workforce Development
This episode was recorded live at SEMICON West 2024 – SEMI’s flagship tradeshow where the global industry gathers to showcase its latest products and technologies; and discuss topics cr…
Navigating The Touchpoints of the Semiconductor Equipment Journey
The semiconductor industry supply chain continues to capture attention as general awareness about the importance of semiconductors in our everyday lives grows.
The news of global expansi…
3D InCites Members Share Perspectives from SEMICON West 2024
This week’s episode was recorded live at SEMICON West where 10 of our community members have news to share. The conversation focused on the latest advancements in semiconductor technolo…