3D InCites Podcast
As a semiconductor industry community, 3D InCites brings to life the people, the personalities, and the minds behind heterogeneous integration and related technologies in a uniquely personal way. The goal is to inform key decision-makers about progress in technology development, design, standards, infrastructure, and implementation.The 3D InCites Podcast provides a forum for our community members to discuss all kinds of topics that are important to running a business in the semiconductor industry, from marketing to market trends, important issues that impact our industry, and our success stories.
- Update frequency
- every 7 days
- Average duration
- 35 minutes
- Episodes
- 175
- Years Active
- 2021 - 2025
Relocating SEMICON West: Phoenix's Rise in the Semiconductor Industry
SEMI's flagship event, SEMICON West, is moving to Phoenix, Arizona this October 7-9, 2025, after 35 years in San Francisco, coinciding with the region's semiconductor manufacturing boom…
San Diego Calling: Your Complete Guide to the IMAPS Symposium
The IMAPS International Symposium returns to the Town & Country Resort in San Diego from September 29-October 2, 2024, featuring restructured technical tracks, new Monday panel discussi…
Beyond Silicon: The Power of X-Ray Metrology in Advanced Packaging
X-ray technology reveals what the naked eye cannot see - the intricate world of semiconductor interconnects that power our digital lives. In this deep dive with Ben Peecock, Senior Dire…
Can Thailand Compete in the Global Chip Race?
Thailand is positioning itself as a new hotspot for semiconductor and microelectronics manufacturing, building on existing infrastructure and establishing key partnerships throughout th…
From Electrons to Photons: ASE's Vision for Sustainable AI
The race toward more powerful AI carries a hidden cost that's becoming impossible to ignore: skyrocketing energy consumption. Did you know AI is projected to devour 10% of global electr…
3D InCites Members Reveal Breakthrough Technologies at ECTC 2025
The 75th anniversary celebration of ECTC in Dallas showcases a remarkable evolution in advanced packaging technologies, revealing how semiconductor priorities have dramatically shifted.…
The AI Revolution: Energy, Ethics, and Advanced Packaging
What happens when the world's thirst for artificial intelligence collides with physical limitations? The answer lies at the intersection of silicon innovation and packaging technology.
F…
ECTC at 75: Pioneers Reflect on Packaging's Past and Future
What happens when you gather 75 years of packaging innovation under one roof? The Electronic Component Technology Conference (ECTC) has transformed from a modest gathering of 300 electr…
From Tape-Out to Co-Design: The Evolution of 3DIC Technologies
Pratyush Kamal explains how 3DIC technologies are transforming semiconductor design as Moore's Law slows, requiring closer integration between chip and package design to maximize perfor…
Revolutionizing Semiconductor Quality: The Dynamic Planar CT Advantage
Andrew Mathers, Principal Product Line Manager at Nordson Test and Inspection, discusses the revolutionary advancements in 3D x-ray inspection technology and how they're improving semic…
The Wireless Golden Gateway: Why Advanced Packaging Professionals Should Attend IMS 2025
The IEEE MTTS International Microwave Symposium attracts over 9,000 attendees and 500+ exhibitors to share cutting-edge developments in RF, microwave, and advanced packaging technologie…
Acoustic Inspection: The Key to Semiconductor Reliability
Acoustic inspection stands as a silent sentinel in semiconductor manufacturing, detecting microscopic defects that could lead to catastrophic failures in high-value applications. Bryan …
Chip Champions: How The 3D InCites Award Winners Are Revolutionizing Heterogeneous Integration
The 3D InCites Podcast celebrates microelectronics industry innovation with a special episode featuring this year's award winners in heterogeneous integration and chiplet technology.
• S…
Why Supply Chain Resilience Matters and How to Get It
Navigating today's complex manufacturing landscape demands unprecedented supply chain resilience. This eye-opening conversation with Barry O'Dowd (Kuehne+Nagel) and Kamal Ahluwalia (Res…
3D InCites Member Spotlight: How Advanced Packaging is Transforming the Semiconductor Landscape
The 3D InCites Member Spotlight episode features exclusive conversations with industry leaders at IMAPS Device Packaging Conference 2025, exploring the cutting-edge of semiconductor pac…
From IMAPS DPC 2025: How Arizona's Universities and Schools Are Revolutionizing Semiconductor Education
Arizona is transforming into the "Silicon Oasis" of America through an unprecedented collaboration that's reshaping semiconductor education from high school through graduate studies. At…
From IMAPS DPC 2025: How Artificial Intelligence is Transforming Industries and Society
What happens when AI diagnoses patients better than doctors? Where does artificial intelligence truly stand on the hype cycle? Is all this computational power actually benefiting societ…
What's In Store for IMAPS DPC 2025: Featuring Amy Lujan, Tim Olson, and Jan Vardaman
Explore the transformative world of microelectronics packaging with industry visionaries Amy Lujan, Tim Olson, and Jan Vardaman as they share their journey at the IMAPS Annual Device Pa…
SEMI ISS 2025 Recap and Semiconductor Market Update
The episode explores the key insights from the recent SEMI ISS event, focusing on the semiconductor industry's journey toward a trillion-dollar market by 2030. It discusses the signific…
The Role of Material Modeling in Semiconductor Packaging Innovation
Unlock the secrets of semiconductor packaging materials with insights from industry experts Dariush Tari and Rose Guino of Henkel's Semiconductor Packaging Materials Division. This epis…