• Guest Name: Chris Riegel • Affiliation: CEO of scala.com • Summary: The discussion centers on High Bandwidth Memory (HBM) as a critical innovation driving the AI revolution. SK Hynix has surpassed competitors by vertically stacking memory chips, overcom
- Author
- John Batchelor
- Published
- Fri 05 Sep 2025
- Episode Link
- https://audioboom.com/posts/8772545
• Guest Name: Chris Riegel
• Affiliation: CEO of scala.com
• Summary: The discussion centers on High Bandwidth Memory (HBM) as a critical innovation driving the AI revolution. SK Hynix has surpassed competitors by vertically stacking memory chips, overcoming the "memory wall" to allow faster data access for AI processors. This technology is crucial for AI development, with the US leading innovation. Strict US and EU export controls aim to prevent China from acquiring advanced chip-making tools. 11960
• Affiliation: CEO of scala.com
• Summary: The discussion centers on High Bandwidth Memory (HBM) as a critical innovation driving the AI revolution. SK Hynix has surpassed competitors by vertically stacking memory chips, overcoming the "memory wall" to allow faster data access for AI processors. This technology is crucial for AI development, with the US leading innovation. Strict US and EU export controls aim to prevent China from acquiring advanced chip-making tools. 11960
