Episode 32: A Conversation with Greg Smith and Tony Lentz About Stencil Design and Void Reduction
- Author
- Mike Konrad
- Published
- Tue 14 Jan 2020
- Episode Link
- https://www.spreaker.com/episode/episode-32-a-conversation-with-greg-smith-and-tony-lentz-about-stencil-design-and-void-reduction--20037074
Episode 32: A Conversation with Greg Smith and Tony Lentz About Stencil Design and Void Reduction
Greg and Tony talk to me about stencil design and how to reduce voiding. Voiding is a key concern in specific electronic applications including automotive and LED electronic manufacturing. Greg and Tony published a paper entitled "Root Cause Stencil Design for SMT Component Thermal Lands"
Download here: https://tinyurl.com/szx3xt8
Greg Smith can be reached here: [email protected]
Tony Lentz can be reached here: [email protected]
