MEP EP#281: Through Hole Manufacturing

MEP EP#281: Through Hole Manufacturing

Through Hole Manufacturing

• Processes
  
  
  • Hand Soldering
  
  
  • Soldering “robot”
  
  
  • Wave soldering
    
    
    • Design Criteria
    
    
    • Pallets
    
    
    
    
  
  
  • Selective soldering
    
    
    • Design Criteria
    
    
    • Keepouts
    
    
    
    
  
  
  
  


• Lead Forming
  
  
  • Pre purchase?
  
  
  • Forming with a die?
  
  
  • Using hand tools?
  
  
  
  


• PCB design
  
  
  • Holes
  
  
  • Non circular?
  
  
  • Annular rings
  
  
  • IPC stuff
    
    
    
    • IPC-2221 Generic Standard on Printed Board Design
    
    
    • IPC-2222 Sectional Design Standard for Rigid Organic Printed Boards
    
    
    • IPC-2223 Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
    
    
    • IPC-7351 Generic Requirements for Surface Mount Design and Land Pattern Standard
      
      
      • Performance Classification (1,2,3)
      
      
      • Producibility Levels (A,B,C)
      
      
      • Land Pattern Determination (Density level A,B,C)