Episode 8: IPO Ambitions, U.S. Fab Shifts & the Rise of AI Infrastructure

In this episode of Chips Weekly by Diana, we dive into three key semiconductor stories shaping the global market:

• China’s Moore Threads and MetaX prepare $1.7B IPOs to challenge Nvidia’s AI lead

• TSMC delays its second Japan fab and shifts focus to U.S. amid geopolitical pressure

• Broadcom rises as a top AI infrastructure play, beyond GPUs

🔍 Industry Spotlight: The growing talent gap in the chip sector—why the race for engineers may define the future of silicon.

💡 Chip of the Week: NVIDIA’s new Hopper H100 NVL, engineered for large-scale AI inference at hyperscale.

#semiconductors #AIchips #NVIDIA #Broadcom #TSMC #chipnews #ChipsWeekly

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