30 Years of Underfill Technology: How Societal and Technological Challenges Impact Materials Development
- Author
- Francoise von Trapp / Richard Jensen
- Published
- Thu 22 Aug 2024
- Episode Link
- https://3dincitespodcast.buzzsprout.com/
In this episode, Françoise von Trapp and underfill materials expert, Dick Jensen, NAMICS corporation explore the societal and technological challenges that impact microelectronic materials development.
The conversation focuses on the evolution of underfill materials development over the past 30 years. They discuss the importance of underfill materials in semiconductor manufacturing, focusing on their compatibility, environmental impact, and properties.
You’ll learn about:
- The development of specialized underfill materials for advanced packaging technologies, including AI chips, and the challenges arising from material changes in electronics manufacturing
- Historical examples of working with restricted substances and how that created a need for alternative materials
- The current need for collaboration and innovation to address the issue of PFAS chemicals in products
- Why and how much testing is important to ensure material compatibility and performance
NAMICS Corporation provides advanced materials and solutions for the semiconductor industry.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
