3D IC
As the semiconductor industry struggles with the limits of Moore’s Law, traditional monolithic scaling is no longer enough to meet performance, power, area and cost demands in technology, design, analysis, and manufacturing.
3D IC by Siemens is your go-to podcast for exploring the cutting-edge world of 3D IC packaging—a revolutionary approach reshaping semiconductor design, system integration, and heterogeneous computing.
Join industry leaders, engineers, and innovators as we break down advanced IC packaging solutions like 2.5D/3D IC, FCBGA, FOWLP, and more. Discover how chiplets, multi-die integration, and high-bandwidth memory (HBM) are driving higher performance, lower power consumption, and scalable architectures.
In each episode, we dive deep into the challenges and opportunities of IC design and manufacturing, including:
- Roadmap for advanced packaging and heterogeneous integration in semiconductor scaling
- Mainstream adoption of 3D IC—key challenges and breakthroughs
- Optimizing micro-architecture and integration platforms for performance and efficiency
- Strategic planning of chiplets and interposers for hierarchical device integration
- Leveraging early predictive multi-physics analysis to enhance design accuracy
- Automating design and routing for RDL-based fan-out wafer-level packaging (FOWLP)
- Exploring glass substrates for superior electrical and thermal performance
- Developing test-vehicles and daisy chain designs for architectural validation
- Ensuring reliability and manufacturability in 3D IC heterogeneous integration
- Mastering Signal Integrity (SI) and Power Integrity (PI) Analysis for high-speed systems
- Managing thermal challenges in stacked die architectures
Subscribe now and stay ahead in the world of 3D IC.
Learn more: Siemens 3D IC Packaging Solutions
- Update frequency
- every 16 days
- Average duration
- 18 minutes
- Episodes
- 17
- Years Active
- 2022 - 2025
Why Every 3D IC Needs a Test Vehicle Before It Hits Production
How do you ensure that cutting-edge 3D IC designs can actually be manufactured before investing millions in production?
What you’ll learn…
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What test vehicles are and why they’re indispensable fo…
00:18:09 |
Thu 04 Sep 2025
Breaking Down 50 Million Pins: A Smarter Way to Design 3D IC Packages
How do you design and verify a package with tens of millions of pins — without losing months to manual rework?
What you’ll learn…
Why chiplet-based architectures demand new approaches to IC p…
00:10:28 |
Thu 21 Aug 2025
Why SI/PI is Mission-Critical for 3D IC Success
How do you ensure clean, stable power and reliable signal transmission in a dense 3D IC stack without introducing late-stage surprises?
What you’ll learn…
What SI/PI means and why it’s essential …
00:15:45 |
Thu 07 Aug 2025
From Chiplets to Systems: Overcoming the Hidden Pitfalls of 3D IC Design
What does “multiphysics” really mean in 3D IC design—and why is it more important than ever to start early?
What you’ll discover:
Learn how early predictive multiphysics analysis can help pre…
00:17:51 |
Thu 24 Jul 2025
Why 3D ICs Need a Mindset Shift—and How to Make It Happen
What does it take to turn 3D IC from a buzzword into a successful reality, and how early should you start thinking about system-level planning?
Get practical insight into why system-level planning…
00:25:30 |
Thu 10 Jul 2025
The Hidden Heat Challenge of 3D ICs—and What Designers Need to Know
Why is thermal analysis no longer an afterthought in 3D IC design—and what is Siemens doing to empower engineers across every step of the process?
In this episode of the Siemens EDA Podcast Series…
00:18:01 |
Thu 26 Jun 2025
Why Traditional PCB Methods Fall Short in 3D IC Design
Why are companies rapidly adopting fan-out wafer-level packaging (FO-WLP)—and how does this shift impact the traditional chip design process?
In this episode of the Siemens 3D IC Podcast Series, h…
00:13:27 |
Thu 12 Jun 2025
3D IC is Here—But Is Your Architecture Ready for It?
As 3DIC adoption ramps up, it’s becoming clear: microarchitecture needs a rethink. So how do you design hardware that can survive and thrive in the new era of stacked silicon?
In this episode of t…
00:16:22 |
Thu 29 May 2025
The Future of 3D ICs: How Advanced Packaging is Changing the Industry
How are 3D Integrated Circuits (3D ICs) revolutionizing semiconductor design, and what role do advanced packaging technologies play in this transformation?
In this episode of the Siemens EDA Podca…
00:12:00 |
Thu 15 May 2025
Uncovering 2.5D and 3D IC Tests
One of the best ways to speed-up product development is to integrate test as early as possible in the design cycle. This shift-left strategy becomes even more critical when advanced IC designs evolve…
00:21:07 |
Mon 13 Feb 2023
Getting Started with 3D IC
3D IC designs are complex puzzles that engineers have to solve to achieve high performance and reliability. While vertical stacking gives more design options, it also increases the possible number of…
00:27:17 |
Tue 08 Nov 2022
3D IC Integration Challenges
A common challenge faced when actualizing new technologies such as 3D IC is the lack of specialized tools to mass assemble them. That’s because their designs are normally developed by R&D teams that …
00:21:08 |
Tue 12 Jul 2022
3D IC Physical Design Workflow
One of the challenges of designing 3D IC chips is getting data from different sources in different formats to work together. You also need a solution that allows you to verify different components su…
00:20:05 |
Thu 14 Apr 2022
3D IC Front-End Architecture
For 3D IC to achieve its full potential there is a need to utilize cost-effective front-end design approaches. This is because different microarchitectures will result in different physical sizes, po…
00:22:03 |
Wed 23 Mar 2022
3D IC Package Design Flows
In most cases, it’s very expensive to get game-changing technological advancements in electrical components to the market. This is because they also require the advancement of the existing design wor…
00:14:29 |
Wed 09 Mar 2022
The Application and Adoption of 3D IC
Standardization plays an important role in promoting the mass adoption of new electrical components. For instance, Application-Specific Standard products, known as ASSP components have been broadly a…
00:12:46 |
Wed 16 Feb 2022
An Introduction to 3D IC
Electronic circuits design has become more complex due to the consumers’ need for more features that require more processing capability. To keep up with these demands, new methodologies of designing …
00:22:03 |
Wed 26 Jan 2022
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